We use cookies. Find out more about it here. By continuing to browse this site you are agreeing to our use of cookies.
#alert
Back to search results
New

Principal Electrical Engineering System Architect

Microsoft
United States, Washington, Redmond
Oct 16, 2025
OverviewThe Microsoft Surface Devices team is on a mission to deliver iconic end-to-end products across hardware, software, and services that people trust and rely on every day. Central to this mission is ensuring highly performant devices that leverage next generation technologies, especially in the development of system architecture. The Surface team is hiring a Principal Electrical Engineering System Architect to architect and lead the vision for secure, revolutionary devices that enable experiences people can't live without. As a Principal Electrical Engineering System Architect, you will lead the architecture and integration of complex electrical systems for next-generation hardware platforms. This role involves defining system-level design strategies, technical specifications, and implementation plans for System on Chip (SOC) integration, power delivery, and thermal optimization. You will develop and validate high-fidelity models, author technical documentation, and establish performance and reliability benchmarks. In addition, you will guide cross-functional teams through subsystem bring-up, prototype development, and design verification, ensuring alignment across silicon vendors, Operating System (OS) partners, and internal engineering teams.Microsoft's mission is to empower every person and every organization on the planet to achieve more. As employees we come together with a growth mindset, innovate to empower others, and collaborate to realize our shared goals. Each day we build on our values of respect, integrity, and accountability to create a culture of inclusion where everyone can thrive at work and beyond.
ResponsibilitiesArchitect electrical systems for platforms and products including covering SOC integration, Dynamic Random Access Memory (DRAM) co-packaging, Universal Flash Storage (UFS) storage, and secure Input/Output (I/O).Lead power delivery and thermal architecture, including survivability metrics and battery life modeling.Drive subsystem architecture reviews, milestone alignment, and bring-up goals across programs.Enable advanced features such as adaptive charging, auto-lock, and repairability.Collaborate with silicon vendors, OS teams, and internal stakeholders to influence roadmap decisions.Author and maintain technical documentation including Power Delivery Network (PDN) impedance modeling and performance testing.Embody the Microsoft culture and values.
Applied = 0

(web-c549ffc9f-j8rxw)